OUTLINE DESCRIPTIONS:

- MANUFACTURER OF SEMICONDUCTOR EQUIPMENT SPARE PARTS,T/C & CERAMIC PARTS,

PACKAGE SAW BLADE,BOAT CARRIER, MAGAZINE, AND SO ON .

提供半导体设备备件，陶瓷零件，包装，料盒，载体等。

产品以及应用APPLICATIONS & PRODUCTS:

- SPARE PARTS – EQUIPMENT FOR SEMI-PACKAGE ASSEMBLY
备品备件 - 半导体设备装配

- MAGAZINE, BOAT CARRIER – SEMI- FLIP CHIP, BGA/CSP

料盒，载体 – 应用在半导体，倒装芯片，BGA / CSP等