概要OUTLINE DESCRIPTIONS :

- SEMICONDUCTOR FOR EOL ( END-OF-LINE ) SUCH AS CSP STACK SYSTEM, TSOP STACK SYSTEM,

SOLDER-BALL ATTACH SYSTEM AND TRIM/FORM/SINGULATION SYSTEM.

半导体/太阳能/印刷电路板生产设备制造商。

植球机SOLDER BALL MOUNTER:

- BGA / CSP packaging, which require solder ball attach process, consists of die bond, wire bond, molding, solder ball attach, singulation, vision inspection & test. This system is to attach solder balls onto substrate or
wafers using fluxing (resin material) and vacuum ball pick & placement technologies.

采用BGA / CSP封装，锡球，需要重视过程，包括绑定，焊线，铸造，焊接
球附加，singulation，视力检查及测试。该系统是附加到基板或焊球晶圆用熔剂（树脂材料）和真空球选择与放置技术。